* Max rDS(on) = 2.5mΩ at VGS = 10V, ID = 25A
* Max rDS(on) = 4.5mΩ at VGS = 4.5V, ID = 18.5A
* Ultra-thin package: less than 0.85mm height when mounted to PCB.

* DC - DC Conversion
* POL converters Index slot D G Bottom Top FLFBGA 3.5X4.0 MOSFET Maximum Ratings TA =.

Combining Farichild’s 30V PowerTrench process with state-ofthe-art BGA packaging, the FDZ4670 minimize both PCB space and rDS(on) . This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal .

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